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MX-SSD2C Laser Stealth Cutting Equipment
The equipment is applied in laser stealth cutting of silicon wafer such as MEMS, RFID and other products, with its advanced intelligent system to ensure the quality and efficiency of product cutting.
Equipment Advantage
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    Equipped with high precision linear motor and high speed X-Y motion platform
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    Equipped with high precision dynamic focus tracking and compensation system to ensure the stability of wafer cutting
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    Equipped with laser spot shaping and compensation function to improve laser efficiency and wafer cutting quality
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    The software is easy to operate and the equipment is convenient to maintain
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Equipment Picture
Basic Parameters
  • 1. Applicable Products： MEMS, RFID, etc
  • 2. Applicable wafer size：200mm-300mm
  • 3. Laser head：Infrared solid-state laser(Different types of wafers are matched with different wavelengths of lasers)
  • 4. Cutting speed：0-1000mm/s
  • 5. Processing method：full-automatic
  • 6. Laser spot shaping and compensation system：SLM
  • 7. Wafer surface tracking system：DFT
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